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Kit helps designers bridge gap between un-connected embedded products to cloud-connected products.
December 3, 2015
By: DAVID SAVASTANO
Editor, Ink World Magazine
NXP Semiconductors N.V. unveiled the LPC43S67-A70CM Cloud Connectivity Kit, designed to significantly reduce time-to-market for deploying IoT products. The kit helps designers bridge the gap between un-connected embedded products to cloud-connected products without the need for deep expertise in security, Wi-Fi stacks, device commissioning and cloud service APIs. NXP collaborated with ecosystem partner Zentri, known for creating a single platform stack that helps companies build connected pro...
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